| Electronic Components Datasheet Search |
|
HF88M08 Datasheet(PDF) 6 Page - King blillion Electronics Co.,Ltd. |
|
|
|||||||||||||||||||||||||||||
HF88M08 Datasheet(HTML) 6 Page - King blillion Electronics Co.,Ltd. |
|
6 / 19 page ![]() King Billion Electronics Co., Ltd 駿 億 電 子 股 份 有 限 公 司 HF88M08 January 16, 2004 Page 6 of 19 V1.11 This specification is subject to change without notice. Please contact sales person for the latest version before use. Die Size: X= 2870 µm, Y=4840 µm, and substrate is connected to GND. Pad No. Pad Name X Coord. Y Coord. Pad No. Pad Name X Coord. Y Coord. 1 WEN 1028.23 4726.24 22 VSS 1222.34 140.91 2 RS0 836.35 4726.24 23 VSS 1501.38 108.09 3 P17 495.57 4722.3 24 D3 1664.02 109.14 4 P14 308.13 4722.3 25 D4 1851.18 109.14 5 P07 108.33 4097.34 26 D5 2038.62 109.14 6 P06 108.33 3743.44 27 D6 2225.78 109.14 7 P05 108.33 3262.4 28 D7 2725.87 105.79 8 P04 108.33 3071.78 29 CEN 2725.87 340.24 9 NC 108.33 2786.78 30 P12 2725.87 537.52 10 NC 108.33 2598.09 31 OEN 2725.87 730.47 11 NC 108.33 2315.6 32 P13 2728.88 3911.29 12 NC 108.33 2127.68 33 P11 2728.88 4116.11 13 NC 108.33 1843.32 34 P10 2728.88 4318.77 14 P03 108.33 1656.15 35 P15 2728.87 4531.23 15 P02 108.33 1357.04 36 P16 2728.87 4725.13 16 P01 108.33 1169.6 37 RS1 2107.66 4736 17 P00 108.33 758.2 38 RS2 1908.12 4736 18 D0 108.33 403.24 39 VDD 1578.76 4688.71 19 D1 395.97 109.14 40 VDD 1404.34 4688.71 20 D2 583.13 109.14 41 VDD 1229.92 4688.71 21 VSS 985.16 190.94 6 Device Operation The device provides the capability of accessing the contents of ROM array by external MCU not through standard address and data bus configuration but through minimal number of 8-bit data bus and control pins. Only 11 pins D7 ~ D0, CEn, OEn, WEn are required to use the device as a Data File device. By fixing the RS2 to ‘0’, only CEn, WEn, OEn and D0 ~ D7 are required to access the ROM array data. The CEn pin is device selection pin to uniquely select one device when more than one device are used in parallel and control the access to Mask ROM contents and internal registers. Whenever CEn goes high, the internal Mask ROM will enter standby (power saving) mode and accesses to internal registers are inhibited. Otherwise, it is in active mode. Therefore, when accessing contents of ROM is not intended, CEn should stay at ‘1’ to conserve the power. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |