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CPC1708 Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1708
Description  i4-PAC??DC Power Relay
PDF  6 Pages
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1708 Datasheet(HTML) 1 Page - Clare, Inc.

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www.clare.com
DS-CPC1708-R01
1
CPC1708
i4-PAC™ DC Power Relay
e3
RoHS
2002/95/EC
Part #
Description
CPC1708J
i4-PAC (25 per tube)
Parameters
Ratings
Units
Blocking Voltage
60
V
P
Load Current, T
A=25ºC
11.85
With 5°C/W Heat Sink
A
DC
No Heat Sink
4
On-resistance
0.08
Ω
RθJC
0.35
ºC/W
Applications
Features
Description
Ordering Information
Pin Configuration
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Transportation Equipment
• Aerospace/Defense
• 100% Solid State
• Compact i4-PAC Power Package
• Low Thermal Resistance (0.35°C/W)
• 11.85A
DC Load Current with 5ºC/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Arc-Free With No Snubbing Circuits
• 2500V
rms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of High Power Solid State Relays. As part of this new
family, the CPC1708 1-Form-A DC Solid State Relay
employs optically coupled MOSFET technology to
provide 2500V
rms of input to output isolation.
The output is constructed with an efficient MOSFET
switch and photovoltaic die that use Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
allows solid state relays to achieve the highest load
current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500V
rms isolation but also
very low thermal resistance (0.35°C/W).
12
3
4
+-
-
+
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+
Approvals
• UL recognized component: File # E69938
• Certified to UL 508


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