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CPC1709 Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1709
Description  ISOPLUS??264 DC Power Relay
PDF  6 Pages
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1709 Datasheet(HTML) 1 Page - Clare, Inc.

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www.clare.com
DS-CPC1709-R02
1
CPC1709
ISOPLUS™-264 DC Power Relay
e3
RoHS
2002/95/EC
Part Number
Description
CPC1709J
ISOPLUS-264 (25 per tube)
Parameter
Rating
Units
Blocking Voltage
60
V
P
Load Current, T
A=25ºC
With 5°C/W Heat Sink
22.8
A
DC
No Heat Sink
9
On-resistance
0.05
Ω
RθJC
0.3
ºC/W
Applications
Features
Description
Ordering Information
Pin Configuration
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
• 100% Solid State
• Compact ISOPLUS-264 Power Package
• Low Thermal Resistance (0.3°C/W)
• 22.8A
DC Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500V
rms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of High Power Solid State Relays. As part of
this new family, the CPC1709 single pole normally
open (1-Form-A) DC Solid State Relay employs
optically coupled MOSFET technology to provide
2500V
rms of input to output isolation.
The output is constructed with an efficient MOSFET
switch and photovoltaic die that uses Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique ISOPLUS-264 package pioneered by
IXYS allows solid state relays to achieve the highest
load current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500V
rms isolation but also
very low thermal resistance (0.3°C/W).
Switching Characteristics of Normally
Open (Form A) Devices
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+
Approvals
• UL recognized component: File # E69938
• Certified to UL 508
12
3
4
+-
-
+


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