Advanced Low Power Schottky Logic – 74ALS86

Quadruple 2-Input Exclusive OR Gate IC in bare die form



High speed – 3ns (Min) propagation delay



Direct drop-in replacement for obsolete

components in long term programs.

Rev 1.0

01/11/22

Features:

Ordering Information

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection

The 74ALS86 is fabricated using a 1.5µm 40V Bipolar

process. The device contains four independent gates and

performs the Boolean functions Y = A ⊕ B = AB + AB in

positive logic.

Description

Die Dimensions in µm (mils)

1500 (59)

Die Size (Unsawn)

1500 x 1400

59 x 55

µm

mils

Minimum Bond Pad Size

130 x 130

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

For High Reliability versions of this product please see

54ALS86

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

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