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CMS05 Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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CMS05 Datasheet(HTML) 3 Page - Toshiba Semiconductor |
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3 / 5 page ![]() CMS05 2006-11-13 3 0.5 0.001 0.01 0.1 1 10 100 1000 1 10 100 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm × 1.4 mm Device mounted on a glass-epoxy board Soldering land: 6.0 mm × 6.0 mm Device mounted on a ceramic board Soldering land: 2.0 mm × 2.0 mm Instantaneous forward voltage vF (V) iF – vF Average forward current IF (AV) (A) PF (AV) – IF (AV) Average forward current IF (AV) (A) Average forward current IF (AV) (A) Tℓ max – IF (AV) Time t (s) rth (j-a) – t 0.1 0 0.2 1 10 0.4 0.6 0.8 1.0 1.2 100 Tj = 150°C 75°C 25°C 125°C 0 2 0 0.4 0.8 1.2 1.6 3.2 2.4 2.8 2 4 6 8 10 α = 60° α = 120° α = 180° DC 360° 0° α Rectangular waveform Conduction angle: α 1 0 2 3 5 6 160 60 0 20 40 80 100 4 7 8 120 α = 60° α = 120° α = 180° DC 140 Conduction angle: α VR = 15 V 360° 0° α Rectangular waveform IF (AV) Ta max – IF (AV) Device mounted on a ceramic board (board size: 50 mm × 50 mm) 1 0 2 3 5 6 160 60 0 20 40 80 100 4 7 8 120 Rectangular waveform 360° 0° α Conduction angle: α VR = 15 V IF (AV) 140 α = 60° 180° DC 120° |
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