3

3 - 159

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Harmonics of LO

LO Freq. (GHz)

nLO Spur at RF Port

1234

2.5

29

35

48

30

326

33

51

39

428

32

39

43

528

36

45

52

636

44

60

41

740

36

58

34

846

37

55

46

LO = +15 dBm

Values in dBc below input LO level measured at RF Port.

MxN Spurious Outputs

nLO

mRF

0

1234

0xx1

15

28

69

1150

30

39

50

269

67

78

60

71

395

95

95

73

95

4

9595959595

RF = 5.6 GHz @ -10 dBm

LO = 5.5 GHz @ +15 dBm

Data taken without IF 90˚ hybrid

All values in dBc with reference to output power at IF= 100 MHz

Absolute Maximum Ratings

RF / IF Input

+20 dBm

LO Drive

+27 dBm

Channel Temperature

150 °C

Continuous Pdiss (T=85°C)

(derate 14.2 mW/°C above 85°C)

925 mW

Thermal Resistance (R

TH

)

(channel to die bottom)

70.2 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004” SQUARE

4. BACKSIDE METALIZATION: GOLD

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. CONNECTION NOT REQUIRED FOR

UNLABELED BOND PADS.

8. OVERALL DIE SIZE ±.002”

Standard

Alternate

WP-3

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC620

v01.1007

GaAs MMIC I/Q MIXER

3 - 7 GHz