TLRME17DP(F)

2007-10-01

1

TOSHIBA LED Lamp

TLRME17DP(F)

Panel Circuit Indicator

• Lead(Pb)-free products (lead: Sn-Ag-Cu)

• 5mm package

• InGaAℓP technology

• All plastic mold type

• Diffused color lens

• High intensity light emission

• Excellent low current light output

• Applications:

outdoor message signboards, safety equipment, automotive use, etc

Lineup

Product Name

Color

Material

TLRME17DP(F)

Red

P

InGaAl

Product Name

Forward Current

Reverse Voltage

Power Dissipation

Operating

Temperature

Storage

Temperature

TLRME17DP(F)

50

4

120

−40~100

−40~120

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Typ. Emission Wavelength

Luminous Intensity

Forward Voltage

Reverse Current

Product Name

Δλ

Min

Typ.

Typ.

Max

Max

TLRME17DP(F)

626

(636)

23

20

153

500

20

1.9

2.4

20

50

4

Unit

nm

mA

mcd

mA

V

mA

μA

V

Precautions

Please be careful of the following:

• Soldering temperature: 260°C max, soldering time: 3 s max

(soldering portion of lead: up to 1.6 mm from the body of the device)

• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress

to the resin. Soldering should be performed after lead forming.

• This visible LED lamp also emits some IR light.

If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.

Unit: mm

JEDEC

―

JEITA

―

TOSHIBA

4-5AJ2

Weight: 0.31 g (Typ.)