TLP716

2007-10-01

2

Absolute Maximum Ratings (Ta=25°C）

CHARACTERISTIC

SYMBOL

RATING

UNIT

Forward Current (Ta ≤ 85°C)

20

mA

Forward Current Derating (Ta > 85°C)

−0.5

mA/

°C

Peak Transient Forward Current (Note1)

1

A

Reverse Voltage

5

V

Junction Temperature

Tj

125

°C

Output Current (Ta ≤ 85°C)

10

mA

Output Current Derating (Ta > 85°C)

−0.25

mA/

°C

Output Voltage(Vo ≤ Vcc)

−0.5~6

V

Supply Voltage

−0.5~6

V

Power Dissipation (Ta ≤ 85°C)

40

mW

Power Dissipation Derating (Ta > 85°C)

ΔPo/ΔTa

-1

mW/

°C

Junction Temperature

Tj

125

°C

Operating Temperature Range

Topr

−40~100

°C

Storage Temperature Range

Tstg

−55~125

°C

Lead Solder Temperature(10s)

Tsol

260

°C

Isolation Voltage

(AC,1min.,R.H.≤60%,Ta=25

°C)

(Note2)

BVs

5000

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Recommended Operating Conditions

CHARACTERISTIC

SYMBOL

MIN.

TYP.

MAX.

UNIT

Input Current , ON

8

12

18

mA

Input Voltage , OFF

0

—

0.8

V

Supply Voltage (*) (Note3, Note4)

4.5

5

5.5

V

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

(*) This item denotes operating ranges, not meaning of recommended operating conditions.