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QIC0620003 Datasheet(PDF) 2 Page - Powerex Power Semiconductors |
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QIC0620003 Datasheet(HTML) 2 Page - Powerex Power Semiconductors |
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2 / 2 page ![]() Preliminary Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272 Dual IGBT Common Emitter Module 200 Amp/600 Volts QIC0620003 200 Amp/600 Volts Maximum Ratings, Tj=25 °°°°C unless otherwise specified Ratings Symbol QIC0620003 Units Collector Emitter Voltage VCES 600 Volts Gate Emitter Voltage VGES ±20 Volts Collector Current IC 200 Amperes Peak Collector Current ICM 400* Amperes Diode Forward Current IF 50 Amperes Diode Forward Surge Current IFM 500 Amperes Junction Temperature Tj -40 to 150 °C Storage Temperature Tstg -40 to 125 °C Mounting Torque, M6 Terminal Screws - 40 In-lb Mounting Torque, M6 Mounting Screws - 40 In-lb Module Weight (Typical) - 200 Grams V Isolation VRMS 2500 Volts *Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating. Static Electrical Characteristics, Tj=25 °°°°C unless otherwise specified Characteristic Symbol Test Conditions Min. Typ. Max. Units Collector Cutoff Current ICES VCE=VCES VGE=0V - - 1.0 mA Gate Leakage Current IGES VGE=VGES VCE=0V - - 0.5 µA Gate-Emitter Threshold Voltage VGE(th) IC=20mA, VCE=10V 4.5 6.0 7.5 Volts Collector-Emitter Saturation Voltage VCE(sat) IC=200A, VGE=15V - 2.1 2.8 Volts IC=200A, VGE=15V, Tj=150 °C - 2.15 - Volts Total Gate Charge QG VCC=300V, IC=200A, VGS=15V - 600 - nC Diode Forward Voltage VFM IF=50A, VGS=0V - - 2.8 Volts Dynamic Electrical Characteristics, Tj=25 °°°°C unless otherwise specified Characteristic Symbol Test Conditions Min. Typ. Max. Units Input Capacitance Cies - - 20 nF Output Capacitance Coes - - 7 nF Reverse Transfer Capacitance Cres VGE=0V VCE=10V f=1MHz - - 4 ns Turn on Delay time td(on) - - 200 ns Rise Time tr - - 550 ns Turn- off Delay Time td(off) - - 300 ns Fall Time tf VCC=300V IC=200A VGE1=VGE2=15V RG=3.1 Ω - - 300 ns Diode Reverse Recovery Time trr - - 110 ns Diode Reverse Recovery Charge Qrr IF=50A diF/dt=-100A/ µS - 0.37 - µC Thermal and Mechanical Characteristics, Tj=25 °°°°C unless otherwise specified Characteristic Symbol Test Conditions Min. Typ. Max. Units Thermal Resistance, Junction to Case RθJC Per IGBT - 0.14 TBD °C/W Thermal Resistance, Junction to Case RθJC Per Diode - 0.70 TBD °C/W Contact Thermal Resistance, Thermal Grease Applied RθCF Per Module - - 0.075 °C/W |
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