CSU Series Datasheet

1

2

Type

CSU382

Biased Humidity

MIL-STD-202 Method 103

(85[ºC], 85[%RH] 1.000[h], 10% rated power)

±[%]

0,5

Operational Life

Mil-STD-202 Method 108

125[ºC] at rated power , 1000[H]

±[%]

1,0

Mechanical Shock

Mil-STD-202 Method 213

(100 [G] for 6[ms] , Half sine)

±[%]

0,2

Vibrations

Mil-STD-202 Method 204

(10 to 2000 [Hz], 5 [G] for 20 [min], 12 cycles, each of 3 orientation

±[%]

0,2

Resistance to Soldering Heat

IEC60115-1 clause 4.18 and Mil-STD-202 Method 210

(260[°C], 10[s])

0,5

Short Time Overload

(U=5 *

,

5[s]

±[%]

1,0

Low Temperature Storage

-65[ºC] 24[H]

±[%]

0,5

Solderability

IEC60068-2-20 and J-STD-002

Solder bath method (> 95% coverage)

Rapid change of temperature

IEC60115-1 clause 4.19 and IEC60068-2-14

(30 [min] -55 [ºC] and 30 [min] +150 [ºC] ,1000 Cycles)

±[%]

0,5

High Temperature Exposure

Mil-STD-202 Method 108

+170[ºC] 1000[H]

±[%]

1,0

Marking

IEC60062

Value imprinted

Size

Value

Resistance

values

TCR

Material

Power Rating

Resistive alloy

[m

Ω]

[ppm/

ºC]

P70 [W] P100 [W]

TCR [ppm]

CSU382

0.3

L3

< 300

Copper Manganese Alloy

10

5

<±10

0.5

L5

Copper Manganese Alloy

9

5

1.0

R001

< 100

Aluchrom Alloy

8

5

<-25

2.0

R002

Aluchrom Alloy

6

4