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ISL73096RHX/SAMPLE Datasheet(PDF) 11 Page - Renesas Technology Corp

Part # ISL73096RHX/SAMPLE
Description  Radiation Hardened Ultra High Frequency NPN/PNP Transistor Arrays
PDF  11 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL73096RHX/SAMPLE Datasheet(HTML) 11 Page - Renesas Technology Corp

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ISL73096RH, ISL73127RH, ISL73128RH, ISL73096EH, ISL73127EH, ISL73128EH
FN6475 Rev 4.00
Page 11 of 11
June 27, 2014
Package Outline Drawing
K16.A
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
Rev 2, 1/10
SIDE VIEW
TOP VIEW
SECTION A-A
-D-
-C-
SEATING AND
BASE PLANE
-H-
BASE
LEAD FINISH
METAL
PIN NO. 1
ID AREA
0.022 (0.56)
0.015 (0.38)
0.050 (1.27 BSC)
0.440 (11.18)
0.005 (0.13)
MIN
MAX
0.115 (2.92)
0.045 (1.14)
0.045 (1.14)
0.026 (0.66)
0.285 (7.24)
0.245 (6.22)
0.009 (0.23)
0.004 (0.10)
0.370 (9.40)
0.250 (6.35)
0.03 (0.76) MIN
0.13 (3.30)
MIN
0.006 (0.15)
0.004 (0.10)
0.009 (0.23)
0.004 (0.10)
0.019 (0.48)
0.015 (0.38)
0.0015 (0.04)
MAX
0.022 (0.56)
0.015 (0.38)
0.015 (0.38)
0.008 (0.20)
PIN NO. 1
ID OPTIONAL
1
2
4
6
3
LEAD FINISH
1.
adjacent to pin one and shall be located within the shaded area shown.
The manufacturer’s identification shall not be used as a pin one
identification mark. Alternately, a tab may be used to identify pin one.
2.
of the tab dimension do not apply.
3. The maximum limits of lead dimensions (section A-A) shall be
measured at the centroid of the finished lead surfaces, when solder
dip or tin plate lead finish is applied.
4.
5.
shall be molded to the bottom of the package to cover the leads.
6.
meniscus) of the lead from the body. Dimension minimum shall
be reduced by 0.0015 inch (0.038mm) maximum when solder dip
lead finish is applied.
7.
8.
NOTES:
Dimensioning and tolerancing per ANSI Y14.5M - 1982.
Controlling dimension: INCH.
Index area: A notch or a pin one identification mark shall be located
If a pin one identification mark is used in addition to a tab, the limits
Measure dimension at all four corners.
For bottom-brazed lead packages, no organic or polymeric materials
Dimension shall be measured at the point of exit (beyond the



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