Package information

TDA7491HV

16/26

5

Package information

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: http://www.st.com.

Figure 21.

PowerSSO-36 package dimensions

DIM.

mm

in c h

MIN.

TYP.

M AX. MIN . T YP.

MAX.

A

2.15

2.4 7 0.08 4

0.097

A2

2 .1 5

2.4 0 0.084

0.09 4

a1

0

0.075

0

0.003

b

0.18

0.3 6 0.00 7

0.014

c

0.23

0.3 2 0.00 9

0.012

10.10

10 .50 0 .3980.413

7.47.6

0 .2910.299

e0.5

0 .019

e3

8.5

0.335

F2.3

0 .090

G

0.1 0

0.00 4

G1

0 .06

0 .002

H

10.10

10.5 0 0.39 8

0.413

h

0.4 0

0.01 6

k

û

5û

L

0.55

0.9 0 0.02 2

0.035

M4.3

0 .169

N10û

10û

O1.2

0 .047

Q0.8

0 .031

S2.9

0 .114

T

.65

0.144

U1.0

0 .039

X4.1

4 .70.161

0 .185

Y6.5

7 .30.256

0 .287

(1) "D” and“E" d onot in clu de m o

ld flash o rprotru sio n sMo ld

fla sh

or pr

otrusio n ssh a ll n o t

exce ed 0.

1 5 mm p e r s

id e (

0.006”)

Po

Po

we r

o

7587131 A

G

L E AD C O PL AN AR IT Y

BO T T O M VIEW

D

e3

0.1

A

MB

b

e

A

Y

T

M

L

hx 45

û

U

O

B

exposed pad (or slug) down

Outline and mechanical data