PWM

TAO/FLT

CSD96497Q5MC

IOUT

REFIN

VIN

VOS

VSW

PGND

VDD

EM/FCCM

LSET

BOOT

BOOT_R

CVDD

PGND

PGND

PWM

TAO/FLT

IOUT

REFIN

EM/FCCM

RVDD

5VIN

RLSET

PGND

PGND

PGND

RBOOT

CBOOT

VIN

CIN

VOUT

Output Current (A)

0

10

20

30

40

50

60

65

30

0

40

3

50

6

60

9

70

12

80

15

90

18

100

21

VDD = 5V

VIN = 12 V

VOUT = 1.8 V

LOUT = 150 nH

fSW = 600 kHz

TA = 25°C

D000

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Folder

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Now

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Software

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Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

CSD96497Q5MC

SLPS714A – JANUARY 2019 – REVISED MARCH 2019

CSD96497Q5MC Synchronous buck NexFET™ smart power stage

1

1 Features

1

•

65-A continuous operating current capability

•

Over 93.5% system efficiency at 30 A

•

High-frequency operation (up to 1.25 MHz)

•

Diode emulation mode with FCCM

•

Temperature compensated bi-directional current

sense

•

Analog temperature output

•

Fault monitoring - OTP, HS OCP, and short circuit

protection

•

3.3-V and 5-V PWM signal compatible

•

Tri-state PWM input

•

Integrated bootstrap switch

•

Optimized dead time for shoot-through protection

•

High-density QFN 5-mm × 6-mm Footprint

•

Ultra-low-inductance package

•

System optimized PCB footprint

•

DualCool™ packaging

•

RoHS compliant, lead-free terminal plating

•

Halogen free

2 Applications

•

Multiphase synchronous buck converters

–

High-frequency applications

–

High-current, low-duty cycle applications

•

POL DC-DC converters

•

Memory and graphic cards

•

Desktop and server VR12.x and VR13.x V-core

synchronous buck converters

•

High-current POL for network communications

3 Description

The CSD96497 NexFET™ power stage is a highly

optimized design for use in a high-power, high-

density synchronous buck converter. This product

integrates the driver IC and power MOSFETs to

complete the power stage switching function. This

combination produces high-current, high-efficiency,

and high-speed switching capability in a small 5-mm

× 6-mm outline package. It also integrates accurate

current sensing and temperature sensing functionality

to simplify system design and improve accuracy. In

addition, the PCB footprint has been optimized to

help reduce design time and simplify the completion

of the overall system design.

Device Information(1)

DEVICE

MEDIA

QTY

PACKAGE

SHIP

CSD96497Q5MC

13-in Reel

2500

QFN

5.00-mm ×

6.00-mm

Tape

and

Reel

CSD96497Q5MCT

7-in Reel

250

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Application

Typical Power Stage Efficiency