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TSUP10200H Datasheet(PDF) 2 Page - Taiwan Semiconductor Company, Ltd |
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TSUP10200H Datasheet(HTML) 2 Page - Taiwan Semiconductor Company, Ltd |
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2 / 6 page ![]() TSUP10200H Taiwan Semiconductor 2 Version: A2505 THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance(1) RӨJL 1.5 °C/W Junction-to-ambient thermal resistance(2) RӨJA 51.7 °C/W Junction-to-case thermal resistance(2) RӨJC 11.5 °C/W Thermal Performance Notes: 1. With ideal heat sink 2. Units mounted on PCB (16mm x 16mm Cu pad test board) ELECTRICAL SPECIFICATIONS (T A = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT Forward voltage(1) IF = 4A, TJ = 25°C VF 0.75 - V IF = 8A, TJ = 25°C 0.85 0.90 V IF = 4A, TJ = 125°C 0.59 - V IF = 8A, TJ = 125°C 0.69 0.73 V Reverse current @ rated VR(2) TJ = 25°C IR - 10 μA TJ = 125°C - 5 mA Junction capacitance 1MHz, VR = 4.0V CJ 332 - pF Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSUP10200H TO-277A (SMPC4.6U) 6,000 / Tape & Reel |
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