DATA SHEET • SE2623L-R: 2.4 GHz HIGH POWER WIRELESS LAN POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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February 11, 2020 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202397J

3.40

3.50

3.40

3.40

3.50

0.95

0.500 Typ

6X 0.25

0.94

R0.15

Typ

Package

Outline

58% solder coverage

on center pad

Board Metal

Solder Mask Pattern

(Note 6)

Stencil Pattern

(Note 5)

Via Pattern

(Note 4)

Y1350

Notes:

1. All dimensions are in millimeters.

2. Dimensions and tolerances according to ASME Y14.5M-1994.

3. Unless specified, dimensions are symmetrical about center lines.

4. Via hole recommendations:

0.025 mm Cu via wall plating (minimum), via holes to be plated shut or plugged and

capped, both sides.

5. Stencil recommendations:

0.125 mm stencil thickness, laser cut apertures, trapezoidal walls and rounded corners offer

better paste release.

6. Solder mask recommendations:

Contact board fabricator for recommended solder mask offset and tolerance.

1.70

3.40

1.70

0.65 Typ

0.20 Typ

0.16 Typ

0.483

0.15 Typ

3X 0.55

0

0

1.56

1.62

3X 0.55

1.90

0.60 Typ

0.35 Typ

0.500 Typ

0.25 Typ

0.500 Typ

0.70

Typ

0.20 Typ

0.65 Typ

0.60

Typ

4X ø0.457

9X ø0.254

1.83

1.90

Figure 7. SE2623L-R PCB Layout Footprint