4

CDCS504-Q1

SCAS951 – APRIL 2017

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6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VDD

Supply voltage

3

3.6

V

fIN

Input frequency

FS = 0

2

27

MHz

FS = 1

2

27

VIL

Low-level input voltage LVCMOS

0.3 × VDD

V

VIH

High-level input voltage LVCMOS

0.7 × VDD

V

VI

Input voltage threshold LVCMOS

0.5 × VDD

V

CL

Output load test LVCMOS

15

pF

IOH/IOL

Output current

±12

mA

TA

Operating free-air temperature

–40

105

°C

(1)

The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(2)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

(1)

THERMAL METRIC(2)

CDCS504-Q1

UNIT

PW (TSSOP)

8 PINS

RθJA

Junction-to-ambient thermal

resistance

179.9

°C/W

High K

Thermal Airflow (CFM) 0

149

Thermal Airflow (CFM) 150

142

Thermal Airflow (CFM) 250

138

Thermal Airflow (CFM) 500

132

Low K

Thermal Airflow (CFM) 0

230

Thermal Airflow (CFM) 150

185

Thermal Airflow (CFM) 250

170

Thermal Airflow (CFM) 500

150

RθJC(top)

Junction-to-case (top) thermal

resistance

64.9

°C/W

High K

65

Low K

69

RθJB

Junction-to-board thermal resistance

108.7

°C/W

ψJT

Junction-to-top characterization parameter

9

°C/W

ψJB

Junction-to-board characterization parameter

107

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

6.5 Electrical Characteristics – Device Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

IDD

Device supply current

fin = 3.072 MHz; FS = 1

24

mA

fOUT

Output frequency

FS = 0

2

27

MHz

FS = 1

8

108

IIH

LVCMOS input current

VI = VDD; VDD = 3.6 V

10

μA

IIL

LVCMOS input current

VI = 0 V; VDD = 3.6 V

–10

μA

VOH

LVCMOS high-level output voltage

IOH = -–0.1 mA

2.9

V

IOH = -–8 mA

2.4

IOH = -–12 mA

2.2