4

LM2840-Q1, LM2841-Q1, LM2842-Q1

SNVSBE5 – APRIL 2019

www.ti.com

Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1

Submit Documentation Feedback

Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using: PD (MAX) = (TJ(MAX) − TA) / RθJA. Exceeding the maximum allowable power dissipation causes excessive die temperature, and

the regulator goes into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal

shutdown engages at TJ=175°C (typical) and disengages at TJ= 155°C (typical).

6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2)

MIN

MAX

UNIT

VIN

–0.3

45

V

SHDN

–0.3

(VIN + 0.3 V) < 45

V

SW voltage

–0.3

45

V

CB voltage above SW voltage

7

V

FB voltage

–0.3

5

V

Power dissipation(3)

Internally Limited

Maximum junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

HBM ESD Classification Level 2

±2000

V

(1)

All limits specified at room temperature (TA = 25°C) unless otherwise specified. All room temperature limits are 100% production tested.

All limits at temperature extremes are ensured through correlation using standard Statistical Quality Control (SQC) methods. All limits

are used to calculate Average Outgoing Quality Level (AOQL).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating junction temperature(1)

–40

125

°C

Input voltage VIN

4.5

42

V

SW voltage

42

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal impedance is calculated in accordance to JESD 51-7.

(3)

Thermal Resistances were simulated on a 4-layer, JEDEC board

6.4 Thermal Information

THERMAL METRIC(1)

LM284x-Q1

UNIT

DDC (SOT)

6 PINS

RθJA

Junction-to-ambient thermal resistance(2)(3)

121

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

94

°C/W