PTH04040W

19

20

18

Margin

Down

Track

Margin

Up

12

15

9

14

11

+

+

+

1

3

5

10

13

16

17

UVLO

4

6

2

8

Inhibit

GND

GND

VoAdj

−Sense

Vo

+Sense

UDG−05085

A

B

C

C

VO

CO1

330

µF

CO2

330

µF

RSET

1%

0.05 W

CI

1000

µF

(Required)

VI

VI

7

PTH04040W

SLTS238C – SEPTEMBER 2005 – REVISED JUNE 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

STANDARD APPLICATION

A.

For CI, a minimum of 1,000 mF (or 2 × 470 mF) of input capacitance is required for proper operation.

B.

RSET is required to set the desired output voltage from the module higher than the minimum value.

C.

For CO1 and CO2, a minimum of 660 mF (or 2 × 330 mF) of output capacitance is required for load transient

regulation.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

UNIT

Signal input voltages

Track control (pin 18)

–0.3 V to VI + 0.3 V

TA

Operating temperature range over VI range

–40°C to 85°C

Wave solder

Surface temperature of module body or pins

PTH04040WAH

Twave

260°C (1)

temperature

(5 seconds)

PTH04040WAD

PTH04040WAS

235°C (1)

Solder reflow

Treflow

Surface temperature of module body or pins

temperature

PTH04040WAZ

260°C (1)

TS

Storage temperature

–55°C to 125°C

Mechanical shock

Per Mil-STD-883D, Method 2002.3, 1 msec, ½ Sine, mounted

500 G(2)

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20–2000 Hz

10 G(2)

Weight

22.5 grams

Flammability

Meets UL94V-O

(1)

During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated

maximum.

(2)

Qualification limits

2

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