6.3 Thermal Information

THERMAL METRIC(1) (2)

SN54AC00-SP

UNIT

J

W

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

83.1

125.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

26.6

30.85

RθJB

Junction-to-board thermal resistance

47.9

43.4

ψJT

Junction-to-top characterization parameter

N/A

N/A

ψJB

Junction-to-board characterization parameter

N/A

N/A

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7 and Mil Std 883 method 1012.1 (see www.JEDEC.org).

6.4 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C

MIN

MAX

UNIT

MIN

TYP

MAX

VOH

IOH = –50 μA

3 V

2.9

2.9

V

4.5 V

4.4

4.4

5.5 V

5.4

5.4

IOH = –12 mA

3 V

2.56

2.4

IOH = –24 mA

4.5 V

3.86

3.7

5.5 V

4.86

4.7

IOH = –50 mA(1)

5.5 V

3.85

VOL

IOL = 50 μA

3 V

0.1

0.1

V

4.5 V

0.1

0.1

5.5 V

0.1

0.1

IOL = 12 mA

3 V

0.36

0.5

IOL = 24 mA

4.5 V

0.36

0.5

5.5 V

0.36

0.5

IOL = 50 mA(1)

5.5 V

1.65

II

VI = VCC or GND

5.5 V

±0.1

±1

μA

ICC

VI = VCC or GND, IO = 0

5.5 V

4

40

μA

Ci

VI = VCC or GND

5 V

2.6

pF

(1)

Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.

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SN54AC00-SP

SCHS367C – OCTOBER 2008 – REVISED APRIL 2022

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