TLC252, TLC252A, TLC252B, TLC252Y, TLC25L2, TLC25L2A, TLC25L2B

TLC25L2Y, TLC25M2, TLC25M2A, TLC25M2B, TLC25M2Y

LinCMOS

 DUAL OPERATIONAL AMPLIFIERS

SLOS002I – JUNE 1983 – REVISED MARCH 2001

3

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLC252Y, TLC25L2Y, and TLC25M2Y chip information

These chips, properly assembled, display characteristics similar to the TLC252 / 25_2. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJMAX = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VDD

VDD – /GND

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

60

73

(2)

(1)

(8)

(7)

(6)

(5)

(3)

(4)