PACKAGE OPTION ADDENDUM

www.ti.com

23-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

TLV2322ID

Obsolete

Production

SOIC (D) | 8

-

-

Call TI

Call TI

-40 to 85

2322I

TLV2322IDR

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

2322I

TLV2322IDR.A

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

2322I

TLV2322IP

Active

Production

PDIP (P) | 8

50 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-40 to 85

TLV2322IP

TLV2322IP.A

Active

Production

PDIP (P) | 8

50 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-40 to 85

TLV2322IP

TLV2322IPWR

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TY2322

TLV2322IPWR.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TY2322

TLV2324ID

Obsolete

Production

SOIC (D) | 14

-

-

Call TI

Call TI

-40 to 85

TLV2324I

TLV2324IDR

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TLV2324I

TLV2324IDR.A

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TLV2324I

TLV2324IN

Active

Production

PDIP (N) | 14

25 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-40 to 85

TLV2324IN

TLV2324IN.A

Active

Production

PDIP (N) | 14

25 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-40 to 85

TLV2324IN

TLV2324IPWR

Active

Production

TSSOP (PW) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TY2324

TLV2324IPWR.A

Active

Production

TSSOP (PW) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TY2324

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Addendum-Page 1