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LWW5SN Datasheet(PDF) 12 Page - OSRAM GmbH |
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LWW5SN Datasheet(HTML) 12 Page - OSRAM GmbH |
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12 / 18 page  2007-08-16 12 LW W5SN Empfohlenes Lötpaddesign 8) Seite 18 IR Reflow Löten Recommended Solder Pad 8) page 18 IR Reflow Soldering Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected Thermal enhanced PCB Thermisch optimiertes PCB 3 Lötstellen 3 solder points 1.6 (0.063) 11.6 (0.457) ø4.0 (0.157) Heatsink attach 11.6 (0.457) 12.0 (0.472) ø4.0 (0.157) ø2.5 (0.098) Kupfer Copper 1.6 (0.063) OHPY2844 Solder paste stencil Lötpasten Schablone Lötstopplack Solder resist Bare Copper Freies Kupfer |
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