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USBUF01W6 Datasheet(PDF) 9 Page - STMicroelectronics |
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USBUF01W6 Datasheet(HTML) 9 Page - STMicroelectronics |
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9 / 11 page ![]() USBUFxxW6 Packaging information 9/11 3 Packaging information Figure 16. Recommeneded footprint (dimensions in mm) Table 3. SOT323-6L Package Mechanical Data REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 0.8 1.1 0.031 0.043 A1 0 0.1 0 0.004 A2 0.8 1 0.031 0.039 b 0.15 0.3 0.006 0.012 c 0.1 0.18 0.004 0.007 D 1.8 2.2 0.071 0.086 E 1.15 1.35 0.045 0.053 e 0.65 Typ. 0.025 Typ. HE 1.8 2.4 0.071 0.094 L 0.1 0.4 0.004 0.016 Q1 0.1 0.4 0.004 0.016 Table 4. Mechanical specifications Lead plating Tin-lead Lead plating thickness 5 m min 25 m max Lead material Sn / Pb (70% to 90%Sn) Lead coplanarity 10 m max Body material Molded epoxt Flammability UL94V-0 A1 A2 A L HE c Q1 b E D e e 0.65 0.80 1.05 1.05 2.9 0.40 |
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