TLV2471CDBVT datasheet(19/51 Pages) TI

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TJ = +150°C

−55 −40

−10

20 35

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

125

TA − Free-Air Temperature − °C

DGN Package

Low-K Test PCB

θJA = 52.3°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

−25

110

PWP Package

Low-K Test PCB

θJA = 29.7°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

PDIP Package

Low-K Test PCB

θJA = 104°C/W

TLV2470,, TLV2471

TLV2472, TLV2473

TLV2474, TLV2475, TLV247xA

SLOS232E – JUNE 1999 – REVISED JULY 2007

APPLICATION INFORMATION (continued)

Results are obtained with no air flow and using JEDEC Standard Low-K test PCB.

Figure 47. Maximum Power Dissipation vs Free-Air Temperature

The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent

power and output power. The designer should never forget about the quiescent heat generated within the

device, especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most of

the heat dissipation is at low output voltages with high output currents. Figure 48 to Figure 53 show this effect,

along with the quiescent heat, with an ambient air temperature of +70

°C and +125°C. When using V

DD = 3V,

there is generally not a heat problem with an ambient air temperature of +70

°C. But, when using V

DD = 5V, the

package is severely limited in the amount of heat it can dissipate. The other key factor when looking at these

graphs is how the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat

dissipation. But the device should always be soldered to a copper plane to fully use the heat dissipation

properties of the PowerPAD. The SOIC package, on the other hand, is highly dependent on how it is mounted

on the PCB. As more trace and copper area is placed around the device,

θJA decreases and the heat dissipation

capability increases. The currents and voltages shown in these graphs are for the total package. For the dual or

quad amplifier packages, the sum of the RMS output currents and voltages should be used to choose the proper

package.

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