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IMX2378F Datasheet(PDF) 13 Page - Power Integrations, Inc. |
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IMX2378F Datasheet(HTML) 13 Page - Power Integrations, Inc. |
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13 / 36 page ![]() Rev. D 12/24 13 InnoMux2-EP www.power.com The default refresh time is T REFRESH, which is doubled to 2 × TREFRESH during start-up. The longer the refresh time the better, but the MOSFET needs to be turned back on before the end of the primary on time. Once the CV outputs are in regulation the refresh time is reduced to T REFRESH. Because the output is no longer changing, the refresh is only needed to top up CDR and by reducing the refresh time the risk of the primary on time finishing before the refresh is reduced. A diode is required to be placed between the gate-source of each selection MOSFET to provide a path for charging the capacitor. A low forward voltage diode such as a Schottky diode should be used. The optimal capacitor value for CDR depends on the gate charge of the selection MOSFET. The selection MOSFET on-level gate voltage is determined by V BPS × (CDR/(CG + CDR), so it is essential that the gate charge (at 5 V gate voltage) is much smaller than the charge in the CDR capacitor. A typical value for the CDR capacitor is 100 nF. For higher CDR capacitor values, the refresh time might be insufficient and the capacitor will not be able to follow the output during start-up. It is therefore important to select low gate-charge devices for the selection MOSFETs to minimise the required CDR capacitor value as well as to minimise energy required to drive the MOSFETs. High-Side MOSFET Static Pull-Down To ensure that the selection MOSFET gates are held low when the secondary is not in control, the CDR1 and CDR2 pins have an internal pull down circuit “ON” feature to pull the pin low and reduce any voltage on the gate due to capacitive coupling. Synchronous Rectifier Driver The SR driver on the InnoMux2-EP IC is not an “on/off” driver. The SR MOSFET’s gate-source voltage is modulated to regulate the FORWARD pin voltage to roughly -40 mV while the discharge current is flowing in the SR MOSFET. The regulated approach allows for improved noise immunity, removing the possibility of the MOSFET being turned off too early causing increased power loss. A force-on signal provides a boost when turning on the SR MOSFET to charge the gate-source capacitance quickly. A force off signal is used to quickly discharge the gate-source capacitance when operating in CCM and also ensure the MOSFET is held off when the secondary is not conducting. FWD SR GND Force Off Force On EN PI-9706-031423 Figure 13. Synchronous Rectifier Driver Diagram. For optimum performance, an SR MOSFET with a gate-source capacitance of less than 10 nF is recommended. SR Disable Protection In each cycle the SR is only engaged if a new cycle is requested by the secondary controller and the negative edge is detected on the FORWARD pin. SR Static Pull-Down To ensure that the SR gate is held low when the secondary is not in control, the SYNCHRONOUS RECTIFIER DRIVE pin has internal pull down circuit “ON” device to pull the pin low and reduce any voltage on the SR gate due to capacitive coupling from the FORWARD pin. Short/Open SR Protection In order to protect against the SYNCHRONOUS RECTIFIER DRIVE pin system faults, (an SR pin short to ground or SR pin open), the secondary controller has a protection mode that ensures that the SYNCHRONOUS RECTIFIER DRIVE pin is connected to an external FET. If the external capacitance on the SYNCHRONOUS RECTIFIER DRIVE pin is less than 200 pF, the device will assume that the SYNCHRONOUS RECTIFIER DRIVE pin is “open”. If the external capacitance on the SYNCHRONOUS RECTIFIER DRIVE pin is above 20 nF, the device will assume the SYNCHRONOUS RECTIFIER DRIVE pin is “short”. In either of these two cases a fault is detected otherwise the controller will assume an SR FET is connected. In the event SYNCHRONOUS RECTIFIER DRIVE pin fault is detected the secondary controller will stop requesting pulses from the primary and initiate auto-restart. Multi-Output Control The multi-output control regulates each output independently by requesting pulses from the primary based on the FB pin voltages of each output. The transformer energy is then directed to the output that needs the energy on a cycle-by-cycle basis. This is accomplished by turning on the appropriate selection MOSFET in series with either the CV1 or the CV2 output. The transformer shall be designed such that the V OR increases between VCV1 and VCV2 and between VCVHV/VLED. This guarantees that the current through the V LED diode is negligible when the selection MOSFET for either V CV1 or VCV2 is turned on, disabling both MOSFETs will direct the energy delivery to the LED output. InnoMux2-EP Enhanced Audible Noise Reduction The InnoMux2-EP IC has enhanced features for audible noise reduction. Multi-output control can create sub-harmonic frequencies of the switching frequency in the flux of the transformer. These sub- harmonics can fall in the audible range. THE InnoMux2-EP IC avoids such conditions by sharing fractions of discharge pulses between outputs. This is achieved by allowing the first part of the discharge pulse to the V CVHV/VLED output and then turning on the selection MOSFET part way through the discharge and allowing the second part of the discharge to flow via the V CV1 or VCV2 output. The point at which the MOSFET is turned on to switch over from the L ED/CVHV output to the CV1 or CV2 output is dependent on the relative loading of the outputs. This provides an added benefit of reducing the RMS currents in the secondary windings, reducing power loss. The operating frequency of each output is increased (while the power switch frequency remains the same) reducing the output ripple for a given filter capacitance. |
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