UCC2915, UCC3915

15V PROGRAMMABLE HOT SWAP POWER MANAGER

SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001

2

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

description (continued)

When the output current is below the fault level, the output MOSFET is switched on with a nominal ON resistance

of 0.15

Ω. When the output current exceeds the fault level, but is less than the maximum-sourcing level, the

output remains switched on, but the fault timer starts, charging CT. Once CT charges to a preset threshold, the

switch is turned off, and remains off for 50 times the programmed fault time. When the output current reaches

the maximum sourcing level, the MOSFET transitions from a switch to a constant current source.

The UCC3915 can be put into sleep mode, drawing only 100

µA of supply current. Other features include an

open-drain fault-output indicator, thermal shutdown, undervoltage lockout, 7-V to 15-V operation, and

low-thermal resistance SOIC and TSSOP power packages.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

VIN

15.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VOUT – VIN

.0.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FAULT sink current

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FAULT voltage

–0.3 V to 8 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current

Self limiting

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TTL input voltage

–0.3 to VIN

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Junction temperature, TJ

–55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature (soldering, 10 sec.)

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data Book (TI Literature

Number SLUD002) for thermal limitations and considerations of packages.

package information

DIL-16, SOIC-16

N, DP Package

(TOP VIEW)

TSSOP-24,

PWP Package

(TOP VIEW)

*Pin 5 serves as lowest impedance to the electrical

ground; Pins 4, 12, and 13 serve as heat sink/ground.

These pins should be connected to large etch areas to

help dissipate heat. For N Package, pins 4, 12, and 13

are N/C.

*Pin 9 serves as lowest impedance to the electrical ground;

other GND pins serve as heat sink/ground. These pins should

be connected to large etch areas to help dissipate heat.

B3

N/C

N/C

GND*

GND*

FAULT

VIN

EGND*

GND*

GND*

VIN

N/C

GND*

SHTDWN

GND*

B2

GND*

GND*

CT

12

11

10

9

8

7

6

5

4

3

2

1

13

14

15

16

17

18

19

20

21

22

23

24

IMAX

VOUT

VOUT

B1

B0

FAULT

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

VOUT

VOUT

GND*

GND*

CT

IMAX

B0

SHTDWN

VIN

VIN

GND*

EGND*

B3

B2

B1