A

A

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PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

14X

0.3

0.2

2.05

0.05

14X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

8X 0.5

2X

2

2X 1.5

0.1 MIN

A

3.6

3.4

B

3.6

3.4

0.3

0.2

0.5

0.3

(0.05)

VQFN - 1 mm max height

RGY0014B

PLASTIC QUAD FLATPACK - NO LEAD

4223385/A 11/2016

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

6

9

13

7

8

14

2

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

15

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.300

DETAIL

OPTIONAL TERMINAL

TYPICAL

TYPICAL

A-A 25.000

SECTION A-A

21

TUSB215-Q1

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SLLSF07 – SEPTEMBER 2017

Product Folder Links: TUSB215-Q1

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