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PACKAGE OUTLINE

C

8X

0.40

0.28

2.7 0.1

8X

0.5

0.4

2X

1.95

1.8 0.1

6X 0.65

1.05 MAX

0.05

0.00

0.32

0.12

B

3.4

3.2

A

3.4

3.2

(0.2) TYP

4X (0.2)

2X (0.98)

VSON - 1.05 mm max height

DPB0008A

PLASTIC SMALL OUTLINE - NO LEAD

4218873/B 11/2024

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

REFER TO NOTE 4

1

4

5

8

0.1

C A B

0.05

C

EXPOSED

THERMAL PAD

9

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance

4. Exposed metals on side wall may vary & not visible.

SCALE 3.600