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LM5010A, LM5010A-Q1

SNVS376F – OCTOBER 2005 – REVISED MAY 2016

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Copyright © 2005–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For detailed information on soldering plastic HTSSOP and WSON packages, see Mechanical, Packaging, and Orderable Information.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

6

75

V

VIN to RTN

–0.3

76

V

BST to RTN

–0.3

90

V

SW to RTN (steady state)

–1.5

V

BST to VCC

76

V

BST to SW

14

V

VCC to RTN

–0.3

14

V

SGND to RTN

–0.3

0.3

V

SS to RTN

–0.3

4

V

VIN to SW

76

V

All other inputs to RTN

–0.3

7

V

Lead temperature (soldering, 4 sec)(2)

260

°C

Junction temperature (LM5010A, Q1,Q0)

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings: LM5010A

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

(2)

Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows safe

manufacturing with a standard ESD control process.

(3)

Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250 V CDM allows safe

manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM5010A-Q1, LM5010-Q0

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)(2)

±2000

V

Charged-device model (CDM), per AEC Q100-011(3)

±750

(1)

VCC provides bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

6

75

V

IO

Output current

1

A

Ext-VCC

External bias voltage(1)

8

13

V

TJ

Operating junction temperature

LM5010A

–40

125

°C

LM5010A-Q1, LM5010-Q0

–40

150

°C