LMC6024

SNOS621D – AUGUST 2000 – REVISED MARCH 2013

www.ti.com

Absolute Maximum Ratings

(1) (2)

Differential Input Voltage

±Supply Voltage

Supply Voltage (V+

− V−)

16V

Lead Temperature

Soldering, 10 sec.

260°C

Storage Temperature Range

−65°C to +150°C

Voltage at Output/Input Pin

(V+) + 0.3V, (V−)

− 0.3V

Current at Input Pin

±5 mA

Current at Output Pin

±18 mA

Current at Power Supply Pin

35 mA

Output Short Circuit to V+

See(3)

Output Short Circuit to V−

See(4)

Junction Temperature

150°C

ESD Tolerance(5)

1000V

Power Dissipation

See(6)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test

conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Do not connect output to V+ when V+ is greater than 13V or reliability may be adversely affected.

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature and/or

multiple Op Amp shorts can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30

mA over long term may adversly affect reliability.

(5)

Human body model, 100 pF discharge through a 1.5 k

Ω resistor.

(6)

The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) − TA)/θJA.

Operating Ratings

Temperature Range

−40°C ≤ TJ ≤ +85°C

Supply Voltage Range

4.75V to 15.5V

Power Dissipation

See(1)

Thermal Resistance (

θJA)

(2)

14-Pin DIP

85°C/W

14-Pin SOIC

115°C/W

(1)

For operating at elevated temperatures the device must be derated based on the thermal resistance

θJA with PD = (TJ − TA)/θJA.

(2)

All numbers apply for packages soldered directly into a PC board.

2

Submit Documentation Feedback

Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LMC6024