LMV796, LMV797

SNOSAU9D – MARCH 2006 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

2000V

ESD Tolerance(3)

Machine Model

200V

Charge-Device Model

1000V

VIN Differential

±0.3V

Supply Voltage (V+ – V−)

6.0V

Input/Output Pin Voltage

V+ +0.3V, V−

−0.3V

Storage Temperature Range

−65°C to 150°C

Junction Temperature(4)

+150°C

Infrared or Convection (20 sec)

235°C

Soldering Information

Wave Soldering Lead Temperature (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model is 1.5k

Ω in series with 100pF. Machine Model is 0Ω in series with 200pF.

(4)

The maximum power dissipation is a function of TJMAX, θJA. The maximum allowable power dissipation at any ambient temperature is PD

= (TJMAX - TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to 125°C

−40°C ≤ TA ≤ 125°C

2.0V to 5.5V

Supply Voltage (V+ – V−)

0°C

≤ TA ≤ 125°C

1.8V to 5.5V

5-Pin SOT-23

180°C/W

Package Thermal Resistance (

θJA)

(2)

8-Pin VSSOP

236°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics tables.

(2)

The maximum power dissipation is a function of TJMAX, θJA. The maximum allowable power dissipation at any ambient temperature is PD

= (TJMAX - TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.

2.5V Electrical Characteristics

Unless otherwise specified, all limits are specified for TA = 25°C, V

+ = 2.5V, V− = 0V, V

CM = V

+/2 = V

O. Boldface limits apply

at the temperature extremes.

Min

Typ

Max

Symbol

Parameter

Conditions

Units

(1)

(2)

(1)

0.1

±1.35

VOS

Input Offset Voltage

mV

±1.65

LMV796/LMV796Q(3)

−1.0

TC VOS Input Offset Voltage Temperature Drift

μV/°C

LMV797(3)

−1.8

0.05

1

−40°C ≤ TA ≤ 85°C

25

IB

Input Bias Current

VCM = 1.0V

(4) (5)

pA

0.05

1

−40°C ≤ TA ≤ 125°C

100

IOS

Input Offset Current

VCM = 1.0V

(5)

10

fA

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the

statistical quality control (SQC) method.

(2)

Typical values represent the parametric norm at the time of characterization.

(3)

Offset voltage average drift is determined by dividing the change in VOS by temperature change.

(4)

Positive current corresponds to current flowing into the device.

(5)

This parameter is specified by design and/or characterization and is not tested in production.

2

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