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LP38869 Datasheet(PDF) 26 Page - Texas Instruments |
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LP38869 Datasheet(HTML) 26 Page - Texas Instruments |
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26 / 27 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) (3.3) (3.3) BASED ON 0.125 THICK STENCIL 14X (0.65) (R0.05) TYP (5.8) 4214868/A 02/2017 PowerPAD HTSSOP - 1.2 mm max height PWP0016A PLASTIC SMALL OUTLINE 2.79 X 2.79 0.175 3.01 X 3.01 0.15 3.3 X 3.3 (SHOWN) 0.125 3.69 X 3.69 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 11. Board assembly site may have different recommendations for stencil design. TM SYMM SYMM 1 8 9 16 BASED ON 0.125 THICK STENCIL BY SOLDER MASK METAL COVERED SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:10X 17 |
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