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ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

PACKAGE SPECIFICATIONS

PTH04000W

SLTS247B – JUNE 2005 – REVISED OCTOBER 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

over operating free-air temperature range unless otherwise noted

(1)

PTH04000W

UNIT

TA

Operating free-air temperature

Over VI range

-40 to 85

°C

Lead temperature (H suffix)

5 seconds

260

Solder reflow temperature (S suffix)

Surface temperature of module body or pins

235

°C

Solder reflow temperature (Z suffix)(2)

Surface temperature of module body or pins

260(2)

Tstg

Storage temperature

-55 to 125

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Moisture Sensitivity Level (MSL) Rating Level-3-260C-168HR

MIN

MAX

UNIT

VI

Input voltage

3

5.5

V

TA

Operating free-air temperature

-40

85

°C

PTH04000Wx (Suffix AH, AS and AZ)

Weight

1.5 grams

Flammability

Meets UL 94 V-O

Mechanical shock

Per Mil-STD-883D, Method 2002.3, 1 msec, sine, mounted

500 G (1)

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000 Hz

20 G (1)

(1)

Qualification limit.

2

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