REG104 datasheet(12/24 Pages) TI2

12 / 24 page

SBVS025G

REG104

FIGURE 10. Thermal Resistance versus PCB Area for the Five-Lead DDPAK.

FIGURE 11. Thermal Resistance versus PCB Area for the Five Lead SOT-223.

012345

Copper Area (inches2)

REG104

Surface Mount Package

1 oz. copper

Circuit Board Copper Area

REG104

DDPAK Surface Mount Package

THERMAL RESISTANCE vs PCB COPPER AREA

180

160

140

120

100

012345

Copper Area (inches2)

Circuit Board Copper Area

REG104

SOT-223 Surface Mount Package

REG104

Surface Mount Package

1 oz. copper

REGULATOR MOUNTING

The tab of both packages is electrically connected to ground.

For best thermal performance, the tab of the DDPAK sur-

face-mount version should be soldered directly to a circuit-

board copper area. Increasing the copper area improves

heat dissipation. Figure 10 shows typical thermal resistance

from junction to ambient as a function of the copper area for

the DDPAK. Figure 11 shows the same relationship for the

SOT-223.

Although the tabs of the DDPAK and the SOT-223 are

electrically grounded, they are not intended to carry any

current. The copper pad that acts as a heat sink should be

isolated from the rest of the circuit to prevent current flow

through the device from the tab to the ground pin. Solder pad

footprint recommendations for the various REG104 devices

are presented in the Application Bulletin

Solder Pad Recom-

mendations for Surface-Mount Devices (SBFA015A), avail-

able from the Texas Instruments web site (www.ti.com).

REG104 Datasheet(PDF) 12 Page - Texas Instruments

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