PCF8883

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© NXP Semiconductors N.V. 2016. All rights reserved.

Product data sheet

Rev. 4.1 — 14 September 2016

21 of 35

NXP Semiconductors

PCF8883

Capacitive touch/proximity switch with auto-calibration

[1]

The x/y coordinates of the alignment mark location represent the position of the REF point (see Figure 19)

with respect to the center (x/y = 0) of the chip.

[2]

The x/y values of the dimensions represent the extensions of the alignment mark in direction of the

coordinate axis (see Figure 19).

17. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that

all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent

standards.

Fig 19. Alignment mark of the PCF8883US die (for location and dimension see Table 10)

Table 10.

Alignment mark dimension and location

Coordinates

x

y

Location[1]

172

m

371 m

Dimension[2]

117

m131 m