4

SN74LS07

SDLS021D – MAY 1990 – REVISED APRIL 2016

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Copyright © 1990–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND.

(3)

This is the maximum voltage that should be applied to any output when it is in the off state.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

7

V

VI

Input voltage(2)

7

V

VO

Output voltage(2)(3)

30

V

TJ

Operating virtual junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.75

5

5.25

V

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

VOH

High-level output voltage

30

V

IOL

Low-level output current

40

mA

TA

Operating free-air temperature

0

70

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

SN74LS07

UNIT

D

(SOIC)

DB

(SSOP)

N

(PDIP)

NS

(SO)

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

85.2

97.4

50.2

82.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

43.5

49.8

37.5

40.9

°C/W

RθJB

Junction-to-board thermal resistance

39.7

44.5

30

41.4

°C/W

ψJT

Junction-to-top characterization parameter

10.9

16.5

22.3

12.4

°C/W

ψJB

Junction-to-board characterization parameter

39.4

44

29.9

41.1

°C/W