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SN74LVC1G86DBVR Datasheet(PDF) 2 Page - Texas Instruments |
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SN74LVC1G86DBVR Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 31 page ![]() 2 SN74LVC1G86 SCES222Q – APRIL 1999 – REVISED JUNE 2017 www.ti.com Product Folder Links: SN74LVC1G86 Submit Documentation Feedback Copyright © 1999–2017, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 5 6.5 Electrical Characteristics........................................... 5 6.6 Switching Characteristics, CL = 15 pF ...................... 6 6.7 Switching Characteristics, CL = 30 pF or 50 pF........ 6 6.8 Operating Characteristics.......................................... 6 6.9 Typical Characteristics .............................................. 6 7 Parameter Measurement Information .................. 7 8 Detailed Description .............................................. 8 8.1 Overview ................................................................... 8 8.2 Functional Block Diagram ......................................... 8 8.3 Feature Description................................................... 8 8.4 Function Table .......................................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application ................................................. 10 10 Power Supply Recommendations ..................... 11 11 Layout................................................................... 12 11.1 Layout Guidelines ................................................. 12 11.2 Layout Example .................................................... 12 12 Device and Documentation Support ................. 13 12.1 Receiving Notification of Documentation Updates 13 12.2 Community Resources.......................................... 13 12.3 Trademarks ........................................................... 13 12.4 Electrostatic Discharge Caution ............................ 13 12.5 Glossary ................................................................ 13 13 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision P (September 2015) to Revision Q Page • Changed YZP (DSBGA) package pinout diagram and added DSBGA column ..................................................................... 3 • Added Balanced High-Drive CMOS Push-Pull Outputs, Standard CMOS Inputs, Clamp Diodes, Partial Power Down (Ioff), and Over-voltage Tolerant Inputs sections..................................................................................................................... 8 Changes from Revision O (December 2013) to Revision P Page • Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 Changes from Revision N (January 2007) to Revision O Page • Updated document to new TI data sheet format. ................................................................................................................... 1 • Removed Ordering Information table. .................................................................................................................................... 1 • Updated Ioff in Features. ......................................................................................................................................................... 1 • Updated operating temperature range. .................................................................................................................................. 4 |
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