FN9025 Rev.10.00

Page 1 of 15

Aug 8, 2019

FN9025

Rev.10.00

Aug 8, 2019

HIP2101

100V/2A Peak, Low Cost, High Frequency Half Bridge Driver

DATASHEET

The HIP2101 is a high frequency, 100V Half Bridge

N-Channel power MOSFET driver IC. It is equivalent to the

HIP2100 with the added advantage of full TTL/CMOS

compatible logic input pins. The low-side and high-side gate

drivers are independently controlled and matched to 13ns.

This gives users total control over dead time for specific

power circuit topologies. Undervoltage protection on both the

low-side and high-side supplies force the outputs low. An

on-chip diode eliminates the discrete diode required with

other driver ICs. A new level-shifter topology yields the

low-power benefits of pulsed operation with the safety of DC

operation. Unlike some competitors, the high-side output

returns to its correct state after a momentary undervoltage of

the high-side supply.

Applications

• Telecom Half Bridge Power Supplies

• Avionics DC-DC Converters

• Two-Switch Forward Converters

Active Clamp Forward Converters

Related Literature

For a full list of related documents, visit our website:

• HIP2101 device page

Features

• Drives N-Channel MOSFET Half Bridge

• SOIC, EPSOIC, QFN and DFN Package Options

• SOIC, EPSOIC and DFN Packages Compliant with 100V

Conductor Spacing Guidelines of IPC-2221

• Pb-free Product Available (RoHS Compliant)

• Bootstrap Supply Max Voltage to 114VDC

• On-Chip 1Ω Bootstrap Diode

• Fast Propagation Times for Multi-MHz Circuits

• Drives 1000pF Load with Rise and Fall Times Typ. 10ns

• TTL/CMOS Input Thresholds Increase Flexibility

• Independent Inputs for Non-Half Bridge Topologies

• No Start-Up Problems

• Outputs Unaffected by Supply Glitches, HS Ringing Below

Ground, or HS Slewing at High dv/dt

• Low Power Consumption

• Wide Supply Range

• Supply Undervoltage Protection

• 3Ω Output Driver Resistance

• QFN/DFN Package:

- Compliant to JEDEC PUB95 MO-220

QFN - Quad Flat No Leads - Package Outline

- Near Chip Scale Package footprint, which improves

PCB efficiency and has a thinner profile