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FDG6316P Datasheet(PDF) 2 Page - ON Semiconductor

Part # FDG6316P
Description  P-Channel 1.8V Specified PowerTrench ®MOSFET
PDF  7 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FDG6316P Datasheet(HTML) 2 Page - ON Semiconductor

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December 2001
2001 Fairchild Semiconductor Corporation
FDG6316P Rev D W)
FDG6316P
P-Channel 1.8V Specified PowerTrench MOSFET
General Description
This
P-Channel
1.8V
specified
MOSFET
uses
Fairchild’s advanced low voltage PowerTrench process.
It has been optimized for battery power management
applications.
Applications
• Battery management
• Load switch
Features
• –0.7 A, –12 V.
RDS(ON) = 270 m
Ω @ VGS = –4.5 V
RDS(ON) = 360 m
Ω @ VGS = –2.5 V
RDS(ON) = 650 m
Ω @ VGS = –1.8 V
• Low gate charge
• High performance trench technology for extremely
low RDS(ON)
• Compact industry standard SC70-6 surface mount
package
S
G
D
D
G
S
Pin 1
SC70-6
S
G
D
D
G
S
6 or 3
5 or 2
4 or 1
1 or 4
2 or 5
3 or 6
The pinouts are symmetrical; pin 1 and pin 4 are interchangeable.
Absolute Maximum Ratings T
A=25
oC unless otherwise noted
Symbol
Parameter
Ratings
Units
VDSS
Drain-Source Voltage
–12
V
VGSS
Gate-Source Voltage
± 8
V
ID
Drain Current – Continuous
(Note 1)
–0.7
A
– Pulsed
–1.8
PD
Power Dissipation for Single Operation
(Note 1)
0.3
W
TJ, TSTG
Operating and Storage Junction Temperature Range
–55 to +150
°C
Thermal Characteristics
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 1)
415
°C/W
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
.16
FDG6316P
7’’
8mm
3000 units



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