TPL7407L

IN3

IN4

OUT1

OUT2

OUT3

OUT4

IN5

IN6

IN7

GND

OUT5

OUT6

OUT7

COM

IN1

IN2

CCOM

GND

Only needed for

fluctuating or

high slew rate

supplies

Ground

13

TPL7407L

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SLRS066D – JANUARY 2014 – REVISED MARCH 2016

Product Folder Links: TPL7407L

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9 Power Supply Recommendations

The COM pin is the power supply pin of this device to power the gate drive circuitry. This ensures full drive

potential with any GPIO above 1.5 V. The gate drive circuitry is based on low voltage CMOS transistors that can

only handle a max gate voltage of 7 V. An integrated LDO reduces the COM voltage of 8.5 V to 40 V to a

regulated voltage of 7 V. Though 8.5 V minimum is recommended for Vcom, the part will still function with a

reduced COM voltage that has a reduced gate drive voltage and a resulting higher Rdson.

The COM pin must be limited to below 0.5 V/

μsTo prevent overvoltage on the internal LDO output due to a line

transient on the COM pin. Faster slew-rate (or hot-plug) may cause damage to the internal gate driving circuitry

due to the LDO's inability to clamp a fast input transient fast enough. Since most modern power supplies are

loaded by capacitors > 10

μF, this should not be of any concern. It is recommended to use a bypass capacitor

that will limit the slew rate to below 0.5 V/

μs.

Figure 11 is a great example where repetitive slew rates may occur on the Vcom pin. Whenever a Zener diode is

used between Vcom and the motor supply, the Vcom pin will slew from the coil supply to a voltage that is the

sum of the Zener voltage and the coil supply when there is a flyback event. Depending on the coil inductance

and resistance, this can be very rapid.

In summary, whenever the COM pin may experience a slew rate greater than 0.5 V/µs a capacitor must be

added to limit the slew to < 0.5 V/µs.

10 Layout

10.1 Layout Guidelines

Thin traces can be used on the input due to the low current logic that is typically used to drive TPL7407L. Care

must be taken to separate the input channels as much as possible, as to eliminate cross-talk. Thick traces are

recommended for the output, in order to drive whatever high currents that may be needed. Wire thickness can be

determined by the trace material's current density and desired drive current.

Since all of the channels currents return to a common ground, it is best to size that trace width to be very wide.

Some applications require up to 2 A.

Since the COM pin will only draw up to 25 µA thick traces are not necessary.

10.2 Layout Example

Figure 13. Package Layout