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MPP10 Datasheet(PDF) 4 Page - Multicomp Pro

Part # MPP10
Description  Thick Film Chip Resistors
PDF  7 Pages
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Manufacturer  MULTICOMP [Multicomp Pro]
Direct Link  https://www.multicomp-pro.com/
Logo MULTICOMP - Multicomp Pro

MPP10 Datasheet(HTML) 4 Page - Multicomp Pro

  MPP10 Datasheet HTML 1Page - Multicomp Pro MPP10 Datasheet HTML 2Page - Multicomp Pro MPP10 Datasheet HTML 3Page - Multicomp Pro MPP10 Datasheet HTML 4Page - Multicomp Pro MPP10 Datasheet HTML 5Page - Multicomp Pro MPP10 Datasheet HTML 6Page - Multicomp Pro MPP10 Datasheet HTML 7Page - Multicomp Pro  
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Page <4>
V1.0
28/07/23
Thick Film Chip Resistors
Newark.com/multicomp-pro
Farnell.com/multicomp-pro
sg.element14.com/b/multicomp-pro
Performance specification
Characteristics
Limits
Test Methods
(AEC - Q200)
Operational Life
Resistance change rate is
±1%: ±(1.0%+0.1Ω)max
±5%: ±(3.0%+0.1Ω)Max.
125°C, at 35% of operating power, 1000H(1.5 hours “ON”, 0.5
hour “OFF”)
(MIL-STD-202 Method 108)
Temperature Coefficient
Resistance change rate is
10Ω< R ≤10Ω : ±200PPM/°C
10Ω< R ≤10MΩ : ±100PPM/°C
4.8 Natural resistance change per temp.
degree centigrade.
R2-R1
R1(t2-t1)
R1: Resistance value at room temperature (T1)
R2: Resistance value at room temp. plus 100°C (T2)
Test pattern: room temp. (T1), room temp. +100°C (T2)
Short Time Overload
Resistance change rate is
±1%: ±(1.0%+0.1Ω)Max
±5%: ±(2.0%+0.1Ω)Max
2.5x Rated voltage or Max. Overload Voltage whichever is
lower for 5 seconds, then check the resistance.
External Visual
No Mechanical Pamage
Electrical test not required.Inspect device construction,
marking and workmanship
(MIL-STD-883 Method 2009)
Physical Dimension
Reference 2.0 Dimension
Standards
Verify physical dimensions to the applicable device detail
specification.
Note: User(s) and Suppliers spec. Electrical test not required.
(JESD22 MH Method JB-100)
Resistance to Solvent
Marking Unsmeared
Note: Add Aqueous wash chemical – OKEM Clean or
equivalent.
Do not use banned solvents.
( MIL-STD-202 Method 215)
Terminal Strength
Not broken
Force of 1.8kg for 60 seconds.
(JIS-C-6429)
High Temperature Expo-
sure
(Storage)
Resistance change rate is
±(1.0%+0.1Ω)max
1000hrs. at T=155°C.Unpowered. Measurement at 24±2
hours after test conclusion.
(MIL-STD-202 Method 108)
Temperature cycling
Resistance change rate is
1%: ± (0.5%+0.1Ω) Max.
5%: ± (1.0%+0.1Ω) Max.
1000 Cycles (-55°C to +155°C). Measurement at 24±2 hours
after test conclusion.
(JESD22 Method JA-104)
Moisture Resistance
Resistance change rate is
1%: ± (0.5%+0.1Ω) Max.
5%: ± (3.0%+0.1Ω) Max.
T=24 hours /cycle. Unpowered. Measurement at 24±2 hours
after test conclusion.
(MIL-STD-202 Method 106)



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