DEVICE INFORMATION

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GND

ANT

AVDD_PA2

GND

NC

RF_N

RXTX

RF_P

QFN-164x4mm

CC2590

SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................ www.ti.com

The CC2590 pinout and description are shown in Figure 1 and Table 1, respectively.

PIN AND I/O CONFIGURATION

(TOP VIEW)

Figure 1.

NOTE:

The exposed die attach pad must be connected to a solid ground plane as this is the

primary ground connection for the chip. Inductance in vias to the pad should be

minimized. It is highly recommended to follow the reference layout. Changes will alter

the performance. Also see the PCB landpattern information in this data sheet.

For best performance, minimize the length of the ground vias, by using a 4-layer PCB

with ground plane as layer 2 when CC2590 is mounted onto layer 1.

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