5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input diode current

For VI < -0.5 V or VI > VCC + 0.5 V

± 20

mA

IOK

Output diode current

For VO < -0.5 V or VO > VCC + 0.5 V

± 20

mA

IO

Output source or sink current per

output pin

For VO > -0.5 V or VO < VCC + 0.5 V

± 25

mA

Continuous current VCC or ground current

± 50

mA

TJ

Junction temperature

150

Tstg

Storage temperature range

– 65

150

Lead temperature (Soldering 10s) (SOIC - lead tips only)

300

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC Types

2

6

V

HCT Types

4.5

5.5

V

VI, VO

Input or output voltage

0

VCC

V

tt

Input rise and fall time

2 V

1000

ns

4.5 V

500

ns

6 V

400

ns

TA

Temperature range

–55

125

℃

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

N (PDIP)

NS (SO)

PW (TSSOP)

UNIT

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

(1)

86

80

76

113

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD54HC4002, CD74HC4002

SCHS197F – AUGUST 1997 – REVISED FEBRUARY 2022

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