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LMP2021, LMP2022

SNOSAY9G – SEPTEMBER 2008 – REVISED FEBRUARY 2016

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(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate

conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the

test conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Package power dissipation should be observed.

(4)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN Differential

–VS

VS

Supply Voltage (VS = V

+ – V−)

6.0

V

All Other Pins

V+ + 0.3

V−

− 0.3

V

Output Short-Circuit Duration to V+ or V−(3)

5

seconds

Junction Temperature(4)

150

°C

Soldering

Information

Infrared or Convection (20 sec)

235

°C

Wave Soldering Lead Temperature (10 sec)

260

°C

Tstg

Storage temperature range

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

all pins(2)

±1000

Machine model

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature Range

−40

125

°C

Supply Voltage (VS = V

+ – V–)

2.2

5.5

V

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LMP2021,

LMP2022

LMP2021

LMP2022

UNIT

D

DBV

DGK

8 PINS

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

106

164

217

°C/W