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LMV651, LMV652, LMV654

SNOSAI7K – SEPTEMBER 2005 – REVISED MAY 2016

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Product Folder Links: LMV651 LMV652 LMV654

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Copyright © 2005–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum power dissipation is a function of TJ(MAX, θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Differential input VID

±0.3

Supply voltage (VS = V

+ - V−)

6

Input or output pin voltage

V−

− 0.3

V+ + 0.3

V

Soldering information

Infrared or convection (20 sec)

235

°C

Wave soldering lead temperature (10 sec)

260

Junction temperature(3)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7

(2)

Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-

C101-C (ESD FICDM std. of JEDEC).

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM)(1)

±2000

V

Machine model(2)

±100

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Temperature

−40

125

°C

Supply voltage

2.7

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LMV651

LMV652

LMV653

UNIT

DCK

(SC70)

DBV

(SOT-23)

DGK

(VSSOP)

PW

(TSSOP)

5 PINS

5 PINS

8 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

303.5

214.2

200.3

134.9

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

135.5

173.3

89.1

60.9

°C/W

RθJB

Junction-to-board thermal resistance

81.1

72.5

120.9

77.3

°C/W

ψJT

Junction-to-top characterization parameter

8.4

56.7

21.7

11.5

°C/W

ψJB

Junction-to-board characterization parameter

80.4

71.9

119.4

76.7

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

n/a

°C/W