LP3995

SNVS179F – FEBRUARY 2003 – REVISED SEPTEMBER 2015

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TJ(MAX) = TTOP + (ΨJT × PD(MAX))

where

•

PD(MAX) is explained in Equation 2

•

TTOP is the temperature measured at the center-top of the device package.

(4)

TJ(MAX) = TBOARD + (ΨJB × PD(MAX))

where

•

PD(MAX) is explained in Equation 2.

•

TBOARD is the PCB surface temperature measured 1-mm from the device package and centered on the

package edge.

(5)

For more information about the thermal characteristics

ΨJT and ΨJB, see TI Application Report Semiconductor

and IC Package Thermal Metrics (SPRA953); for more information about measuring TTOP and TBOARD, see the TI

Application Report Using New Thermal Metrics (SBVA025); and for more information about the EIA/JEDEC

JESD51 PCB used for validating RθJA, see the TI Application Report Thermal Characteristics of Linear and Logic

Packages Using JEDEC PCB Designs (SZZA017). Aforementioned application notes are available at

www.ti.com.

9.2.3 Application Curves

VOUT = 2.8 V

VOUT = 2.8 V

Figure 19. Line Transient Response

Figure 20. Load Transient Response

VOUT = 1.8 V

Figure 21. Load Transient Response

16

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