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LP5900

SNVS358R – JULY 2005 – REVISED JUNE 2016

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10.4 DSBGA Light Sensitivity

Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as

halogen lamps can affect electrical performance if they are situated in proximity to the device.

Light with wavelengths in the red and infra-red part of the spectrum has the most detrimental effect; thus, the

fluorescent lighting used inside most buildings has very little effect on performance.

10.5 WSON Mounting

The 6-lead WSON package requires specific mounting techniques which are detailed in AN-1187 Leadless

Leadframe Package (LLP) (SNOA401). Referring to the section PCB Design Recommendations, it should be

noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask defined)

type. Additionally, it is recommended the PCB terminal pads to be 0.2 mm longer than the package pads to

create a solder fillet to improve reliability and inspection.

The exposed thermal pad on the bottom of the WSON package must be connected to a copper area on the PCB

under the package. TI recommends use of thermal vias to remove heat from the package into the PCB is

recommended. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to

any potential other than the same ground potential seen at device pin 3.