5 Specifications

5.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage

VDD to GND

–0.3

36

V

Output voltage

VOUT to GND

–0.3

VDD + 0.3 (2)

V

Output current

IOUT

–10

10

mA

Temperature

Operating junction temperature, TJ

–60

155

°C

Storage temperature, Tstg

–65

155

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Maximum voltage must not exceed 36V.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VDD

Supply voltage

3

34

V

TA

Operating ambient temperature

–40

150

°C

5.4 Thermal Information

THERMAL METRIC(1)

ISOTMP35R

UNIT

DFP (SSOP)

12 PINS

RθJA

Junction-to-ambient thermal resistance

99.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

127.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

RθJB

Junction-to-board thermal resistance

74.1

°C/W

ψJT

Junction-to-top characterization parameter

92.6

°C/W

ψJB

Junction-to-board characterization parameter

73.4

°C/W

MT

Thermal Mass

TBD

mJ/°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

ISOTMP35R

SNIS244 – SEPTEMBER 2025

www.ti.com

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