AFE031AIRGZRG4 datasheet(53/59 Pages) TI2

53 / 59 page

AFE031

www.ti.com

SBOS531E – AUGUST 2010 – REVISED JUNE 2019

Product Folder Links: AFE031

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11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following application reports and publications (available for download from

www.ti.com):

•

AFE Design for a Narrowband Power-Line Communications Modem Using the AFE031

•

TINA Simulation Schematic of a Two-Node, Power-Line Communication System

•

PowerPAD™ Thermally-Enhanced Package

•

Microcontrollers in Data Concentrators

•

The Signal e-book: A compendium of blog posts on op amp design topics

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.5 Trademarks

PowerPAD, C2000, TINA-TI, E2E are trademarks of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

TINA, DesignSoft are trademarks of DesignSoft, Inc.

SPI is a trademark of Motorola, Inc.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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