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BQ25700ARSNT Datasheet(PDF) 7 Page - Texas Instruments

Part # BQ25700ARSNT
Description  bq25700A SMBus Multi-Chemistry Battery Buck-Boost Charge Controller With System Power Monitor and Processor Hot Monitor
PDF  85 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

BQ25700ARSNT Datasheet(HTML) 7 Page - Texas Instruments

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bq25700A
www.ti.com
SLUSCQ8A – MAY 2017 – REVISED MAY 2018
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Copyright © 2017–2018, Texas Instruments Incorporated
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NUMBER
SRN
19
PWR
Charge current sense resistor negative input. SRN pin is for battery voltage sensing as well.
Connect SRN pin with optional 0.1-μF ceramic capacitor to GND for common-mode filtering.
Connect a 0.1-μF ceramic capacitor from SRP to SRN to provide differential mode filtering.
The leakage current on SRP and SRN are matched. For reverse battery plug-in protection,
10-Ω series resistors are placed on SRP and SRN.
SRP
20
PWR
Charge current sense resistor positive input. Connect 0.1-μF ceramic capacitor from SRP to
SRN to provide differential mode filtering. The leakage current on SRP and SRN are
matched. For reverse battery plug-in protection, 10-Ω series resistors are placed on SRP and
SRN. Connect SRP pin with optional 0.1-uF ceramic capacitor to GND for common-mode
filtering.
SW1
32
PWR
Buck mode high side power MOSFET driver source. Connect to the source of the high side
n-channel MOSFET.
SW2
23
PWR
Boost mode high side power MOSFET driver source. Connect to the source of the high side
n-channel MOSFET.
VBUS
1
PWR
Charger input voltage. An input low pass filter of 1Ω and 0.47 µF (minimum) is
recommended.
VDDA
7
PWR
Internal reference bias pin. Connect a 10-Ω resistor from REGN to VDDA and a 1-μF
ceramic capacitor from VDDA to power ground.
VSYS
22
PWR
Charger system voltage sensing. The system voltage regulation limit is programmed in
REG0x15() and REG0x3E().
Thermal pad
–
–
Exposed pad beneath the IC. Analog ground and power ground star-connected near the IC's
ground. Always solder thermal pad to the board, and have vias on the thermal pad plane
connecting to power ground planes. It also serves as a thermal pad to dissipate the heat.



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